INFRASTRUCTURE


  • Make: Yamaha, Model: YSM10
  • Component Placement Per hour (CPH) 25000
  • Mounting Accuracy ±0.05mm/chip
  • PCB Size 50mmX50mm to 510mmX460mm
  • Component handling range 03015mm to 55mmX100mm
Pick and Place Pick and Place Pick and Place

  • Make: BYS, Module: BY350A
  • 1mtr conveyor for board transportation after Pick and Place to Reflow with SMEMA software connection.
Conveyor Conveyor

  • Make: Heller, Model: 1707 MK III
  • 7 Zone reflow station,
  • Technology for the environment
  • Enhanced flow heater’s and Blower’s
  • Best suited for low/medium & High volume production.
Reflow Oven Reflow Oven

  • Make: Martin, Module: Martin 10.6
  • Precision control unit with high resolution camera with Patented Hot Air Soldering Nozzles
  • Auto-vision placement facility
  • Can handle FPGA / Flip-chip / QFN / DRQFN / LGA / GPS Module etc.. replacement task
Rework Station Rework Station

  • Temperature controlled with auto cut-off facility
  • Temp Range from 0°c upto 200°c and can set upto 1000hrs,
  • Pre-Baking of Moisture Sensitive Device’s
  • Pre-Baking of Bare Printed Circuit Board (PCB)
Hot Burn Oven Hot Burn Oven