SERVICES


  • Our Assembly line is capable of latest component technologies. And our unit facilitates both Automated and Manual assembly of PCBs.
  • Some of the main critical projects handled by us are listed below.

Complexity handled

  • Capable of soldering of all SMD/SMT/PTH. Package range starting from 01005 size.
  • BGA/LGA/ Flipchip & BTC package replacement. ( BTC.. Bottom Terminal components).
  • Toggle press / Pressfit connectors assembly.
  • RoHs and Non-RoHs soldering process.
  • Assembly process compliance to IPC 610 Class II and Class III Standards.

PCB Wise

  • Rigid PCB, Flex PCB, Flex+Rigid+Flex PCB, Aluminum PCB, Metal-core PCB.
  • No of Layers 2 to 24 layer pcb with single and double sided.
  • PCB thickness 0.6mm to 5mm.
  • Smallest PCB size 20mm x 20mm and Maximum PCB size 400mm x 360mm.

Board Density

  • Per board Components upto 2345+ included with Multiple FPGA device’s and BTC Components.
  • POP Package & Back to back BGA device assembly.
  • High density SMD / BGA Samtec Connectors.
  • Min Device Pitch size 10Mills,ball count 8 and Max 40Mills,ball count 1932.

Volume Handled

  • Prototype for R&D
  • Small Quantity 1 -50
  • Pilot Production 1-250
  • Mid Volume up-to 5k
  • Production up-to 10k